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Basic Electronics
Fundamentals of Integrated Circuits
Crystal Growth and Wafer Preparation
Circuit Design and Layout
Wafer Fabrication
Assembly, Packaging and Final Test
Circuit Types
(感谢Mr 同事 借我这本书,并且无限归还期)
Now at least I know roughly what are these terms about : “p” type, “n” type, CMOS, bipolar, Bi-CMOS, doping, n well, source and drain, gate, flats, scribing, ingot, photo mask, reticle, lattice, patterning, photolithography, anisotropic etching, ion implantation, dopant ions, diffusion, anneal process, CVD (chemical vapor deposition), metallization, CMP (chemical mechanical polishing) ……
(ok, if you don’t know what I am talking about then perhaps it’s time for you to take up one similar book to start reading too, ha! :) )
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